Efficient Streaming Language Models With Attention Sinks (MIT, Meta, CMU,...
A technical paper titled “Efficient Streaming Language Models with Attention Sinks” was published by researchers at Massachusetts Institute of Technology (MIT), Meta AI, Carnegie Mellon University...
View ArticleResearch Bits: Mar. 5
Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By...
View ArticleA Hypermultiplexed Integrated Tensor Optical Processor (USC, MIT et al.)
A technical paper titled “Hypermultiplexed Integrated Tensor Optical Processor” was published by researchers at the University of Southern California, Massachusetts Institute of Technology (MIT), City...
View ArticleUltrathin vdW Ferromagnet at Room Temperature (MIT)
A technical paper titled “Current-induced switching of a van der Waals ferromagnet at room temperature” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: “Recent...
View ArticleChip Industry Technical Paper Roundup: Mar. 11
New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations Current-induced switching of a van der Waals ferromagnet at room temperature MIT...
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Chip Industry Week In Review
By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled “National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership....
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AI Takes Aim At Chip Industry Workforce Training
When all the planned fabs become operational, the semiconductor industry is likely to face a worker shortage of 100,000 each in the U.S. and Europe, and more than 200,000 in Asia-Pacific, according to...
View Article2D van der Waals Magnets Above Room Temperature (MIT)
A new technical paper titled “Field-free deterministic switching of all–van der Waals spin-orbit torque system above room temperature” was published by researchers at MIT, with funding by the NSF and...
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Chip Industry Week In Review
SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how...
View ArticleChip Industry Technical Paper Roundup: April 23
New technical papers recently added to Semiconductor Engineering’s library. Technical Paper Research Organizations Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film...
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